Thermal Management

As electronics become more and more powerful yet smaller and smaller, thermal management has become a necessity for all electronic applications.

This section contains a number of thermal transfer materials: compounds, thermal pads, thermally conductive encapsulants (neutral silicone, epoxy, PU) and thermally conductive adhesives (used in place of mechanical fastening of heat sinks).
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By brands

MOLYKOTE
ARALDITE
DOWSIL
KRYTOX
BOSTIK
PERMABOND
ELECTROLUBE
PORCHER-Industries
MERBENIT
XIAMETER
DEVCON
SOCOMORE
DUNA CORRADINI
VOLTALEF
AIRTECH
SYNTHENE
TECTYL
OSIXO
HB FULLER
HERAEUS
SERENYS