Thermal Pads are, in general, pre-cured flexible silicones available in various thicknesses and thermal conductivities but non-silicone versions are available for applications where this technology cannot be used.

They do not require curing and are ideal where surfaces are fairly flat and where the thermal interface thickness will be greater than 100 microns.

The compression and the fact that these materials are already cured allows these thermal interface materials (TIMs) to retain their pre-set shapes.

They are easy to apply and remove, and are ideal for applications where maintenance is expected.
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