Thermal management: Dow Corning Launches Two New Thermally Conductive Adhesives
Dow Corning announced at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies.
Dow Corning TC-2030 thermally conductive adhesive is Dow Corning’s most advanced solution for traditional automotive electronics applications.
Dow Corning TC-2035 thermally conductive adhesive is a high-performance thermal interface material for high-heat automotive applications.
Both products are designed for use in next-generation power electronic modules.
Dow Corning stated that Dow Corning TC-2030reduces thermal resistivity with a high thermal conductivity of 2.7 W/mK. A.
A two-part, heat-cured silicone technology, Dow Corning TC-2030 delivers a significant improvement in elongation performance for a material of such high thermal conductivity.
Dow Corning announced that this technology delivers bond line thickness (BLT) of at least 130 microns and is a suitable thermal interface material for high-power underhood electronic applications, such as power steering, antilock braking and electronic control modules.
Dow Corning TC-2035 drastically reduces thermal resistivity by delivering excellent 3.3 W/mK thermal conductivity and BLT as low as 50 µm. A two-part, heat-cured silicone, Dow Corning announced that TC-2035 bonds reliably to a variety of thermal substrate types, including direct bonding copper, high-density interconnect and low-temperature applications. Furthermore, the material sustains reliable performance at temperatures reaching 200°C (392°F).
To see the properties of these products, click here.