Dow Corning Electronics Has Developed Four New Dispensable Pads

Dispensable pads and printable pads make it possible to quickly and precisely print thermal interfaces with controllable thicknesses and complex shapes on substrates such as heat sinks.

These solutions offer excellent thermal management properties(thermal conductivity and thermal resistance) at a lower cost than prefabricated thermal pads, which require cutting and placement.

This line encompasses four products with varying levels of thermal conductivity:

Dow Corning® TC-4015 and TC-4016 with a thermal conductivity of 1.5 W/mK.

Dow Corning® TC-4025 and TC-4026 with a thermal conductivity of 2.5 W/mK.

Dow Corning® TC-4016 and TC-4026 are filled with glass beads for better control over thermal interface thickness.

For more information:

To learn about Samaro’s other thermal management solutions, download our Thermal Management Selector Guide here.

This guide contains our range of compounds, thermal pads, dispensable pads, thermally conductive encapsulants (RTV & HTV) and thermally conductive adhesives.

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