Electric & Electronic Protection & Assembly

The importance of protecting electronic circuit boards is widely acknowledged. It protects and extends the operating life of components and of the boards themselves.

Various protection solutions are available depending on the type of chemistry (neutral silicone, epoxy, polyurethane, acrylic, water-based, etc.) and the desired type of protection (conformal coating, encapsulant, sealing, thermal management, component bonding, etc.).

Whatever the electronic application, electronic circuit boards need to be protected against risks, such as:

• ESD (electrostatic discharge) shocks
• Overheating
• Humidity
• Water (immersion, etc.)
• Vibrations
• Mechanical shocks
• Salt spray
• Temperatures (low and high)
• Contaminants in general (dust, hydrocarbons, etc.)

Bonding can form part of this protection, such as when adhesives are used to seal housings or when components (power condensers) are bonded together to reduce their movements.

See more See less

By brands

Need help ?

+334 26 680 680

Request for quotation

Electronic Protection: Sealing, Potting and Conformal Coating

Industrial PCBs, components and electronic modules can be exposed to demanding conditions including moisture, condensation, vibration, thermal shock, chemicals, dust and other contaminants.

Several technologies can be considered depending on the required level of electronic protection: silicone sealing, resin potting or encapsulation, and conformal coating.

Samaro distributes solutions from SYLGARD™, DOWSIL™, ARALDITE®, ARADUR®, Electrolube and MG Chemicals to address a wide range of PCB and electronic component protection requirements.

What solutions can be used to protect industrial electronics?

Three main technologies can be considered depending on the required level of protection.

Silicone protection and sealing

One- and two-component silicones can provide sealing, bonding and protection while maintaining flexibility after curing.

This flexibility can be useful when electronic assemblies are exposed to vibration, movement or repeated thermal cycling.

The SYLGARD™ range includes silicone materials developed for the protection and encapsulation of sensitive electronic components.

SYLGARD™ 184 is a two-component silicone used for potting and encapsulation applications including sensors, components and electronic assemblies. It is also widely used in microfluidic applications.

DOWSIL™ solutions, including DOWSIL™ 3145, can be used for bonding, sealing and protecting electronic housings, connectors and components.

Epoxy and polyurethane potting compounds

Potting or encapsulation consists of partially or completely embedding electronic components in a protective material.

This approach can address several types of requirements:

mechanical protection;
electrical insulation;
thermal constraints;
environmental exposure.

ARALDITE® epoxy resins combined with ARADUR® curing agents can be selected for applications requiring appropriate mechanical, dielectric or environmental performance.

Polyurethane potting compounds generally retain greater flexibility after curing than rigid epoxy systems, which can be beneficial for electronics exposed to vibration or mechanical stress.

Viscosity, cure method, hardness and, where required, thermal management should also be considered during product selection.

Explore Samaro’s electronic encapsulants and potting compounds.

Conformal coatings

A conformal coating is a thin protective layer applied to a printed circuit board to help protect its surface against environmental exposure.

Depending on the technology and specific product grade, conformal coatings can help protect against:

moisture and condensation;
contaminants;
salt spray;
certain chemicals;
thermal cycling.

Electrolube and MG Chemicals offer acrylic, polyurethane, silicone and other conformal coating technologies in different application formats.

Specific products within these ranges are designed to meet requirements such as IPC-CC-830, depending on the selected grade.

Explore Samaro’s conformal coating solutions.

How do you choose an electronic protection solution?

Selecting the right technology should start with the actual operating conditions of the PCB or electronic module.

1. Required level of protection
Local sealing, surface protection and full potting provide different levels of coverage and should not be selected for the same reasons.

2. Service environment
Moisture, condensation, temperature, thermal cycling, vibration, chemicals and contaminants should all be identified.

3. Electrical requirements
Operating voltage, required dielectric strength and the risk of electrical arcing may influence material selection.

4. Rigidity or flexibility
A rigid resin and a flexible silicone do not transmit mechanical and thermal stresses to components in the same way.

5. Thermal management
If the protection material also forms part of the heat-transfer path, a thermally conductive solution may need to be considered.

6. Maintenance and repairability
Some protection technologies are easier to remove or rework than others. This should be considered before choosing a permanent potting solution.

7. Manufacturing process
Viscosity, working time, curing method, dispensing process, masking and production rate can all influence the final material choice.

Define the required level of protection before choosing the chemistry

When selecting an electronic protection solution, I first identify what the module needs to be protected against and to what extent: moisture, condensation, vibration, thermal stresses, chemicals or dielectric requirements. Choosing between a conformal coating, a potting compound or a silicone sealant also depends on the geometry, thermal dissipation and potential maintenance requirements. Our role is to bring these constraints together and identify a technology that is consistent with both the component and its service environment.

Esther Joseph

Brand Manager Electrique & Electronic Protection at Samaro

Visit Esther’s LinkedIn profile Discuss your application

Solutions available from Samaro

SYLGARD™ – Dow
Two-component silicone materials for potting and protecting sensors, PCBs and electronic components. Key product: SYLGARD™ 184.

DOWSIL™ – Dow
Silicone adhesives and sealants for bonding, sealing and protecting electronic housings and components. Key product: DOWSIL™ 3145.

ARALDITE® / ARADUR® – Huntsman
Two-component epoxy systems for electronic potting, encapsulation and applications requiring appropriate mechanical and dielectric properties.

Electrolube
Conformal coatings and electronic protection resins including acrylic, polyurethane, silicone and other technologies depending on the application.

MG Chemicals
Solutions for protecting electronic circuits including conformal coatings, encapsulation materials, thermal management products and other specialty materials for electronics.

For a broader selection, explore our pages dedicated to electronic encapsulants, conformal coatings and industrial silicone sealants.

Our technical team can help you identify a protection technology suited to your electronic application, operating environment and manufacturing process.

What protection should you use against moisture and condensation on a PCB?

A conformal coating can provide surface protection against moisture and condensation while adding minimal thickness. For harsher environments or applications requiring greater mechanical protection, potting or additional sealing may be considered.

Conformal coating or potting: which should you choose when the PCB needs to remain repairable?

A conformal coating generally provides easier access to components than full potting. If maintenance or component replacement is important, this requirement should be considered when selecting the protection technology.

Do some areas need to be masked before protecting a PCB?

Yes. Connectors, electrical contacts, optical surfaces, certain sensors and areas that need to remain accessible may require masking before application. The protection and masking plan should therefore be defined according to the PCB design and function.

When should you use a thermally conductive encapsulant?

A thermally conductive encapsulant is relevant when the potting material is also intended to contribute to heat transfer away from electronic components. Thermal conductivity should be considered together with the module geometry and the intended thermal path.

What tests should be carried out before qualifying an electronic protection solution?

Testing should reproduce the actual service conditions as closely as possible, including temperature and thermal cycling, humidity, vibration, chemical exposure and electrical requirements. Adhesion and compatibility with PCB materials and components should also be checked.

Email Téléphone