DOWSIL™ 340 Heat Sink Compound formerly DOW CORNING® 340 Heat Sink Compound, is a base for contacts used in transistors, diodes, components that require a medium service temperature, aircraft engine that require a good heat dissipation.
Dielectric rigidity: 21 kV/mm / Thermal conductivity: 0.42 W/mK / Silicone / Metal oxides / Resists changes in consistency at temperatures up to +177°C (+350.6°F) / Tube: 100 g: also available on request as PMUC version (No. 08047).
DOWSIL™ 340 Heat Sink is provides thermal coupling of electrical/electronic devices, high thermal conductivity, low bleed. Download chemical equivalency certificates by clicking on the Homologation link opposite.
Dangerous. Observe safety precautions - For professional use only