DOWSIL ME 1070

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Applications

Silicone adhesive for microelectronics applications

Caracteristics

Silicone / One part / Black / Heat cure 30 min @150°C / Viscosity 20 000mPa.s / Hardness Shore A72 

Property

Low levels of ionic impurties 

Addition cure silicone ( no byproducts during cure) 

Dangerous. Observe safety precautions - For professional use only
See the different packaging

Variations

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Name Code article Price Availability Security form
DOWSIL ME 1070
10 g Tube
DE1071 Contact us DownloadDownload the technical datasheet
DOWSIL ME 1070
30 g Tube
DE1070 Contact us DownloadDownload the technical datasheet

Caracteristics

Curing Temperature (°C) 150 CELSIUS
Curing Time (min) 30 MINUTE
Curing Type Hot Curing
Chemistry / Technology Silicon
Dielectric Strength (kV/mm) 19 kV_mm
Brand DOWSIL
Color Black
Hardness Class Medium Hard (Shore A61 - A80)
Hardness 72 Ashore
Electric Properties Electrically Insulating
Number of Component Mono Componant / 1 Part
Dynamic Viscosity (25°C) 20000 mPas