Caracteristics
Curing Type | Hot Curing |
---|---|
Chemistry / Technology | Silicon |
Brand | DOWSIL |
Product's associated market | Electronics |
Color | Grey |
Number of Component | Bi Componant / 2 Parts |
Maximum temperature (°C) | 200 CELSIUS |
Minimum temperature (°C) | -45 CELSIUS |
Dynamic Viscosity (25°C) | 77 mPas |