DOWSIL™ TC-5150

Applications

DOWSIL™ TC-5150 is a single component, non-curing gap filler. It is a high performance thermally conductive silicone. Due to its high heat conductive metal oxide filler it has a thermal conductivity of 5W/m.K. This silicone and metal filler combination promotes high thermal conductivity while allowing high temperature stability.

This gap filler improves the heat transfer from the electrical device to the heat sink increasing the overall efficiency of the device.

Caracteristics

Silicone / monocomponent / Blue / Thixotropic / Non curable / density 3.47 / Thermal conductivity 5W/m.K

Benefits:

- high thermal conductivity

- vertical hold

- reworkable

- storage at room temperature

- no additional curing process required

Property

Dangerous. Observe safety precautions - For professional use only

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Variations

This product is not available online.Contact us

Name	Code article	Price					Availability	Security form
DOWSIL™ TC-5150 1 kg Cartridge	DE51501K		Contact us	DownloadDownload the technical datasheet
DOWSIL™ TC-5150 8.5 kg pail	DE5100P		Contact us	DownloadDownload the technical datasheet

Caracteristics

Chemistry / Technology	Silicon
Brand	DOWSIL
Color	Blue
Electric Properties	Electrically Insulating
Number of Component	Mono Componant / 1 Part
Maximum temperature (°C)	125 CELSIUS
Minimum temperature (°C)	-40 CELSIUS
Thermal Conductivity (W/m⋅K)	5 WmK
Thermal Management Solution	Gap Filler

DOWSIL

Electric and Electronic Protection and Assembly

Electronics

DOWSIL™ TC-5150: A Thermally Conductive Gap Filler for Optimal Heat Dissipation

MSDS
TDS

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