HERAEUS F 645 SAC305 -89M30

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Applications
Microbond Product line for Automotive et Industrie
Caracteristics
SA3OC5-89M30 / Alloy SA3OC5 / 89% Metal content / Viscotity M : Print grade / Powder type : 3 / Particle Size: 25 - 45 µm / Melting Point : 217°
Property
Lead free solder paste, Application : Power electronic, No clean, printing process
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
HERAEUS F 645 SAC305 -89M30
500 g Jar
HRF645A Contact us

Caracteristics

Alloy SAC305
Type de poudre Type 3
Brand HERAEUS
Product's associated market Electronics
Halogen Yes / Free / Zero Halogen zero
Flux Type No Clean

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