F823 SA40C5-89M30 solder paste is a ready-touse, homogeneous mixture with low odour characteristics, consisting of metal powder, binders, solvents, fluxes and thixotropic agents.
The material provides a very high Surface insulation resistance of the flux residues. The solder paste is especially optimised to solder Tin-Silver-, Thin-Silver-Copper and Low-meltingalloys
Ag3,5-89L25 / Alloy Ag3,5 / 89% Metal content / Viscotity L : Dipping - Jetting grade / Powder type : 2.5 / Particle Size: 25 - 75 µm / Melting Point : 221°
Especially suitable for Reflow in convection and vacuum ovens.
Exceptional print to print consistency
Min. 8 hours tack and work life
compatible with TF823 Flux
Dangerous. Observe safety precautions - For professional use only