HERAEUS F 823

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Applications
F823 SA40C5-89M30 solder paste is a ready-touse, homogeneous mixture with low odour characteristics, consisting of metal powder, binders, solvents, fluxes and thixotropic agents. The material provides a very high Surface insulation resistance of the flux residues. The solder paste is especially optimised to solder Tin-Silver-, Thin-Silver-Copper and Low-meltingalloys
Caracteristics
Ag3,5-89L25 / Alloy Ag3,5 / 89% Metal content / Viscotity L : Dipping - Jetting grade / Powder type : 2.5 / Particle Size: 25 - 75 µm / Melting Point : 221°
Property
Especially suitable for Reflow in convection and vacuum ovens. Exceptional print to print consistency Min. 8 hours tack and work life compatible with TF823 Flux
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
HERAEUS F 823
500 g Jar
HRF823A Contact us

Caracteristics

Alloy SAC405
Type 3
Brand HERAEUS
Product's associated market Electronics
Halogen Yes / Free / Zero Halogen zero
Flux Type No Clean

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