HERAEUS PC 3001 AG

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Applications
PC 3001 is a thermosetting, one-component, solvent-free, silver-filled epoxy conductiveadhesive, designed for the connection of electronic (SMDs) and bare dies with LTCC and ceramic substrates
Caracteristics
one component / Thermal conductivity : Min. 5 (W/mK) / Vol resistivity Max. 0.3 mΩ.cm / Tg: 38°C / Curing profile: 10 min to 150°C - 20 min to 120°C / Process life: 20h
Property
High electrical and thermal conductivity Very low degassing High reliability
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
HERAEUS PC 3001 AG
40g Syringe S2
HR3001A Contact us

Caracteristics

Chemistry / Technology Epoxy
Brand HERAEUS
Product's associated market Electronics
Number of Component Mono Componant / 1 Part

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