MG CHEMICALS 8331D

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Applications
MG CHEMICALS 8331D is a silver-filled electrically conductive adhesive. This version is thixotropic and adheres to a wide variety of substrates. It provides excellent electromagnetic shielding (EMI Shielding). If a longer working time is needed, then opt for the MG CHEMICALS 8331S version. Used for: Replacing solder for bonding heat-sensitive electronic components / Creating conductive connections when soldering is not possible (e.g., bonding on glass, soft metals, or plastics) / Ensuring EMI/RFI shielding / Filling gaps between metal plates.
Caracteristics
MG CHEMICALS 8331D is a two-component epoxy resin / Mixing ratio: 1:1 / Working time: 4h at 22°C / Curing time: 80 min at 80°C / Viscosity: thixotropic / Shore hardness: 68D / Tensile strength: 4.2 N/mm² / Shear strength (stainless steel): 5.0 N/mm² / Shear strength (aluminum): 6.3 N/mm²
Property
MG CHEMICALS 8331D is a two-component epoxy resin / Viscosity: Thixotropic / Good adhesion to many substrates / Excellent electrical conductivity / Effective for EMI / RFI shielding / Resistant to moisture, saltwater, weak bases, and aliphatic hydrocarbons.
Dangerous. Observe safety precautions - For professional use only
See the different packaging

Variations

This product is not available online.Contact us
Name Code article Price Availability
MG CHEMICALS 8331D
14g Syringe
MG8331S20 Contact us
MG CHEMICALS 8331D
120 g Pot
MG8331S10 Contact us

Caracteristics

conductive filler Silver
Curing Temperature (°C) 65 CELSIUS
Curing Time (min) 10 MINUTE
Curing Type Hot Curing
Chemistry / Technology Epoxy
Brand MG CHEMICALS
Color Grey
Electric Properties Electrically Conductive
Maximum temperature (°C) 150 CELSIUS
Minimum temperature (°C) -50 CELSIUS
Glass transition (Tg) (°C) 35 CELSIUS
Thermal Conductivity (W/m⋅K) 1.5 WmK