MG CHEMICALS 8349 TFM

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Applications
MG CHEMICALS 8329 TFM is a thermally conductive adhesive (0.9W/m.K). This two-component epoxy meets the UL 94 V0 standard and adheres to multiple substrates: metals, ceramics, glass, as well as most plastics. MG CHEMICALS 8349 TFM is designed to attach heat sinks to electronic components such as processors (CPU), light-emitting diodes (LED), and other elements requiring efficient heat management.
Caracteristics
MG CHEMICALS 8329 TFM is a two-component epoxy resin / Mixing ratio: 1:1 / Working time: 20 min / Thermal conductivity: 0.9 W/m.K / Service temperature range: -65°C to +120°C / Hardness: Shore D 92 / Color: Dark gray
Property
MG CHEMICALS 8329 TFM provides effective electrical insulation, preventing short circuits between components. It offers strong resistance to moisture, saltwater, mild bases, and aliphatic hydrocarbons. Complies with UL 94 V-0 standard.
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
MG CHEMICALS 8349 TFM
45 ml Kit
MG8349T30 Contact us

Caracteristics

Application Methode Manual
Curing Type Room Temperature Curing
Chemistry / Technology Epoxy
Brand MG CHEMICALS
Color Grey
Hardness Class Very Hard (Shore D56 - D100)
Hardness 92 Dshore
Electric Properties Electrically Insulating
Number of Component Bi Componant / 2 Parts
Maximum temperature (°C) 120 CELSIUS
Minimum temperature (°C) -65 CELSIUS
Thermal Conductivity (W/m⋅K) 0.9 WmK
Thermal Management Solution Thermaly conductive Adhesives

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