PERMABOND ES579

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Applications
Fastsetting epoxy paste for the bonding of SMC, with improved thermal conductivity (1.3 W/m·K).
Caracteristics
One-part / Viscosity: 60,000 - 90,000 mPa·s / Maximum gap fill: 2mm / Cure time: 60 min at 120°C (275°F) / Max. shear strength: 27-41 MPa / Temperature: -40°C to +180°C (-40°F to +356°F)
Property
One-part, structural epoxy adhesive, good thermal conductivity, white.
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
PERMABOND ES579
320 ml Cartridge
PEES579-320 Contact us

Caracteristics

Curing Type Hot Curing
Chemistry / Technology Epoxy
Brand PERMABOND
Number of Component Mono Componant / 1 Part
Maximum temperature (°C) 180 CELSIUS
Minimum temperature (°C) -40 CELSIUS