Dow Corning Launches Two New Silicones

In order to meet ever-increasing demand for thermal management solutions, Dow Corning, a global leader in silicones, has launched two new thermal management compounds:

 Dow Corning TC-5622 is a silicone compound with a thermal conductivity of 4.3 W/mK. More information is available in the technical data sheet.

 Dow Corning TC-5351 is a silicone compound with a thermal conductivity of 3.3 W/mK. More information is available in the technical data sheet.

These compounds achievethin bond line thicknesses (BLTs) to ensure low thermal resistance. The heat sinks used must be mechanically fastened.

For more information:

Thermal Management Brochure

Go further

AIRTECH
ARALDITE
Composites
DOWSIL
Events
SILASTIC
Samaro, Hall 6, booth C49, is participating in JEC World 2024, from March 5th to 7th at the Paris Nord Villepinte Exhibition Center.
Automotive
DOWSIL
E-Mobility
DOWSIL™ TC-2035 CV: Thermally conductive adhesive for electronic assembly dedicated to the automotive market.
Adhesives & sealants
DOWSIL
Discover or rediscover DOWSIL™ 732, the essential versatile acetoxy silicone sealant.