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DOWSIL™ EE-1010

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Applications
Potting of electronic boards suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum deairing step
Caracteristics
Dark Gray / ratio 1:1 / Viscosity : 840 mPas / Durometer : Shore A60 / Working Time : 50min / Cure Time : 24h at 25°C or 3 min at 100°C / Thermal conductivity : 0.35 W/m.K / Dielectric Strength : 18 KV/mm
Property
Two-part Silicone, 1:1 mix electronics encapsulant with extended working time and low viscosity
Dangerous. Observe safety precautions - For professional use only
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Variations

This product is not available online.Contact us
Name Code article Price Availability
DOWSIL™ EE-1010
36,2 kg Kit
DEEE1010-36 Contact us
DOWSIL™ EE-1010
0,9 kg Kit
DEEE1010 Contact us

Caracteristics

Curing Type Room Temperature Curing
Chemistry / Technology Silicon
Dielectric Strength (kV/mm) 18 kV_mm
Brand DOWSIL
Product's associated market Electronics
Color Grey
Hardness 60 Ashore
Electric Properties Electrically Insulating
Number of Component Bi Componant / 2 Parts
Maximum temperature (°C) 200 CELSIUS
Minimum temperature (°C) -45 CELSIUS
Dynamic Viscosity (25°C) 840 mPas
ARALDITE
DOWSIL
Electric & electronic protection & assembly
ELECTROLUBE
Electronics
Which products to use for the protection of electronic devices?
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