DOWSIL™ TC-4016 Dispensable Thermal Pad

Dispensable Thermal pads for computer microchips, power supplies.

Blue / Mix ratio 1:1 / Viscosity: 103,000 mPa·s / Shore OO50 / Working time: 4 hrs / Cure time: 24 hrs at 25°C (77°F) - 16 min at 100°C (212°F) / Thermal conductivity: 1.7 W/m·K

Electronic silicone / Heat dissipation / Good thermal conductivity / Glass beads added to help control the thickness / Maximum thickness: 1 mm / UL 94 V-0.