DOWSIL™ TC-5888 Thermally Conductive Compound

Applications

DOWSIL™ TC-5888 Thermally Conductive Compound is a gray, thixotropic, non-curing silicone thermally conductive compound designed to provide efficient heat transfer between electronic components and their cooling systems. It is particularly suitable for cooling modules, including computer MPUs and power modules, by creating an effective thermal interface between the heat source and a heat sink, chassis or PCB system assembly.

Caracteristics

Thanks to its solvent-free formulation, DOWSIL™ TC-5888 provides good material stability after the container has been opened and supports consistent application, especially by screen printing, stencil printing or dispensing. Its one-part format requires no curing step, while its thixotropic behavior helps limit slump and enables a thin Bond Line Thickness, contributing to efficient thermal performance in the assembly.

Property

DOWSIL™ TC-5888 combines high thermal conductivity of 5.2 W/m·K .

It offers a typical Bond Line Thickness of 0.02 mm, a specific gravity of 2.6, very low volatile content after 48 hours at 125°C, and viscosity values suitable for industrial application processes. These properties make it a relevant solution for improving thermal dissipation in compact or high-performance electronic devices.

Dangerous. Observe safety precautions - For professional use only

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Variations

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Name	Code article	Price					Availability
DOWSIL™ TC-5888 Thermally Conductive Compound 1 kg Box	DETC58881K		Contact us

Caracteristics
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Caracteristics

Chemistry / Technology	Silicon
Brand	DOWSIL
Color	Grey
Electric Properties	Electrically Insulating
Number of Component	Mono Componant / 1 Part
Thermal Conductivity (W/m⋅K)	5.2 WmK
Thermal Management Solution	Compound

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