EE-3200 PART A

Potting of electronic boards with a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments such as: Power Conversion Devices (Inverters, Converters), Junction Boxes, Automotive Electronics Modules

Dark Gray / ratio 1:1 / Viscosity : 1 700 mPas / Durometer : Shore 00 20 / Elongation : 340% / Working Time : 30min / Cure Time : 3h at 25°C or 20 min at 50°C / Thermal conductivity : 0.5 W/m.K / Dielectric Strength : 14 KV/mm

Two-part Silicone, 1:1 mix electronics encapsulant with low hardness and low viscosity, UL 94 V-0, RTI150, EN45545 approved