EE-3200 PART A

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Applications

Potting of electronic boards with a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments such as: Power Conversion Devices (Inverters, Converters), Junction Boxes, Automotive Electronics Modules

Caracteristics

Dark Gray / ratio 1:1 / Viscosity : 1 700 mPas / Durometer : Shore 00 20 / Elongation : 340% / Working Time : 30min / Cure Time : 3h at 25°C or 20 min at 50°C / Thermal conductivity : 0.5 W/m.K / Dielectric Strength : 14 KV/mm

Property

Two-part Silicone, 1:1 mix electronics encapsulant with low hardness and low viscosity, UL 94 V-0, RTI150, EN45545 approved

Dangerous. Observe safety precautions - For professional use only
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Variations

This product is not available online.Contact us
Name Code article Price Availability
EE-3200 PART A
25 kg Drum
DE3200EEA-25 Contact us
EE-3200 PART A
225 kg Drum
DE3200EEA-225 Contact us
EE-3200 PART A
0,5 kg Bottle
DE3200EEA Contact us

Caracteristics

Application Methode Automatic, Manual
Curing Temperature (°C) 25 CELSIUS
Curing Time (min) 3 HOUR
Curing Type Room Temperature Curing
Certification / Specification EN 45545-2 R22, R23, R24, R25,R26 HL3, UL 94 V0, UL RTI 150
Chemistry / Technology Silicon
Dielectric Strength (kV/mm) 14 kV_mm
Brand DOWSIL
Color Black
Hardness Class Gel (40 - 80 Shore 00 / 0 - 5 Shore A)
Hardness 20 00shore
Electric Properties Electrically Insulating
Multi parts product type Base
Number of Component Bi Componant / 2 Parts
Maximum temperature (°C) 200 CELSIUS
Minimum temperature (°C) -45 CELSIUS
Thermal Conductivity (W/m⋅K) 0.5 WmK
Dynamic Viscosity (25°C) 1700 mPas

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