TECNITE DTI23G

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Applications
Silicone interface with a thermal conductivity of 0,8W/m.K for energy converter, computer memory chips, telecommunications applications.
Caracteristics
Gray / Shore 00 75 / Thermal conductivity : 0,8 W/m.K / Dielectric Strength : >4 kV/mm / UL94 V-0
Property
Silicone, thickness of 0,23 mm, with optionnal adhesive tape on one or both sides with fiberglass reinforcement.
Dangerous. Observe safety precautions - For professional use only
See the different packaging

Variations

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Name Code article Price Availability
TECNITE DTI23G
Roll
TCDTI23G Contact us

Caracteristics

Certification / Specification UL 94 V0
Chemistry / Technology Silicon
Brand TECNITE
Product's associated market Electronics
Color Grey
Electric Properties Electrically Insulating
Thermal Conductivity (W/m⋅K) 0.8 WmK
Thermal Management Solution Thermal Pad